The upcoming iPhone 18 Pro and Pro Max are expected to keep the exact same footprints as their predecessors, but if you hate rocking phones on tables, prepare yourself: the camera bump is getting larger. While early rumors suggested the entire chassis would get thicker and heavier this year, recent leaks and dummy units indicate the extra bulk is strictly confined to the camera plateau.
According to measurements taken from YouTuber Vadim Yuryev on dummy units, the iPhone 18 Pro Max’s total thickness, bump included, will hit 13.77mm. That’s up from the current 17 Pro Max’s 12.92mm. Both the aluminum housing and the lenses themselves are taking up more physical space.
The reason for the extra thickness apparently comes down to a significant hardware upgrade. According to Digital Chat Station on Weibo, they claim Apple is implementing a new 48MP “ultra-large” main camera sensor alongside true variable aperture technology. When you pair a physically larger sensor with mechanical aperture blades and rumored telephoto upgrades, there’s only one way to go – out.
While a massive camera bump, or “plateau” isn’t ideal, at least it’s a sign that a manufacturer is actually investing in new hardware engineering instead of relying on heavy software processing. At a time when most smartphone updates consist of forced AI features and minor software tweaks, a genuine mechanical camera upgrade is a practical trade-off. We’ll have to wait and see how the final design handles in the hand, but for anyone who values actual photo quality over a perfectly flush back glass, the extra millimeter is likely a price worth paying.
