Mobile World Congress 2015 is in full swing, but must of the anticipated announcements are behind us. That includes Samsung’s debut of the Galaxy S6 and HTC’s debut of the One M9. Those devices are arguably two of the biggest flagships of 2015 and they differ in one major way; they have different processors. The HTC One M9 is backed by a Snapdragon 810 whereas the Galaxy S6 is backed by a Exynos 7420.
Late last year, a rumor popped up that Qualcomm was having a hard time keeping the 64-bit octa-core Snapdragon 810 processor cool. It was plagued with overheating issues which led Samsung to switch to their own in-house processor.
Time went on and LG debuted the first device to feature the Snapdragon 810, the G Flex 2. Both LG and Qualcomm stated that there was no more overheating issues and LG even stated that it was cooler than the Snapdragon 801. A new image from MWC 2015 now contradicts that claim.
An image has surfaced online of an HTC One M9 at Mobile World Congress running the popular AnTuTu Benchmark application. While that may not surprise, this sure will. A warning popped up on during the test and stated “The device temperature is too high. Please test again after cooling the device. Continue testing may cause the system to restart or shut down.”
This is either very coincidental or Qualcomm never actually fixed the overheating issues with the Snapdragon 810. It definitely raises some questions surrounding the device, but it could be due to the fact that it was a display model. We don’t know how long the device was plugged in, how extensively it was used, etc. The G Flex 2 did not overheat during the benchmark, so it could be software related. Either way, we’ll keep you posted.